XPG LEVANTE II 360 – Elite Dual‑Chamber 360 mm Liquid CPU Cooler
XPG LEVANTE II 360 – Elite Dual‑Chamber 360 mm Liquid CPU Cooler is backordered and will ship as soon as it is back in stock.
Delivery and Shipping
Delivery and Shipping
Shipped within 3 business days
XPG LEVANTE II 360 – Elite Dual‑Chamber 360 mm Liquid CPU Cooler
| Manufacturer | Xpg |
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The XPG LEVANTE II 360 is a top‑tier all‑in‑one liquid CPU cooler engineered to meet the demands of gamers, content creators and PC enthusiasts. With a 360 mm radiator, high‑efficiency dual‑chamber pump rated for up to 320 W TDP, and striking ARGB infinity‑mirror visuals, it delivers both performance and style in one compact solution.
Key Features
- Dual‑Chamber Pump (Up to 320 W TDP) – Handles high‑end CPUs under heavy loads for overclocking or multitasking.
- 360 mm Radiator + 3 × 120 mm ARGB Fans – Maximises heat dissipation while keeping your system visually impressive and thermally stable.
- 3‑in‑1 Pre‑installed Fan Frame & Infinity Mirror Design – Simplified installation and cable management plus eye‑catching ARGB lighting for show‑piece system builds.
KEY SPECIFICATIONS
| Feature | Specification |
|---|---|
| Radiator Size | 396 × 120 × 27 mm |
| Tube Length | 400 mm sleeved rubber |
| Water‑Block Dimensions | 67 × 62.5 × 50.2 mm |
| Fan Size & Quantity | 3 × 120 mm (120 × 120 × 27 mm each) |
| Fan Speed | 800‑2,000 RPM (±10%) |
| Fan Airflow | ~58 CFM (±10%) |
| Fan Static Pressure | 2.04 mm‑H₂O |
| Noise Level | Avg ~19.78 dB(A) / Max ~29.33 dB(A) |
| Socket Compatibility | Intel LGA 1851/1700/1200/115x • AMD AM5/AM4 |
| Warranty | 5 Years |
| Weight | ~2.4 kg |
* Specifications may vary by region and model variant.
Performance Excellence
With its dual‑chamber pump and large 360 mm radiator, the LEVANTE II 360 is designed to sustain high thermal loads—up to 320 W TDP—making it ideal for modern high‑core‑count CPUs under intense workloads. Testing shows very good results on Intel platforms and competitive performance on AMD builds.
Under full fan speed the noise may rise, yet the quieter PWM control mode helps maintain a balanced system.
User Experience & Comfort
Installation is simplified thanks to the pre‑installed 3‑in‑1 fan frame and clear mounting kit for Intel and AMD sockets. The hydraulic bearing fans deliver smooth operation with less friction and sound over time, and the PWM control ensures the cooler adapts quietly to workload demands.
Visual Quality & Aesthetics
The infinity‑mirror ARGB design on both the pump head and fan hubs makes the LEVANTE II 360 a standout visually. Whether you’re building a tempered‑glass gaming rig or a sleek workstation, this unit brings customisable RGB flair in addition to solid thermal functionality.
Design & Build Quality
Crafted with a copper water block for efficient heat transfer and an aluminium radiator for lightweight durability, the build quality is strong. The 400 mm tubes provide flexible installation in larger cases, and the overall solidity and finish deliver premium feel.
Connectivity & Compatibility
- 4‑pin PWM pump connector for dynamic control
- Daisy‑chained ARGB header compatibility for unified lighting
- Mounting kits included for Intel and AMD mainstream sockets (LGA 1851/1700/1200/115x & AM5/AM4)
Perfect For
- High‑end gaming PCs or workstation builds using demanding CPUs
- Enthusiast systems where both cooling efficiency and visual appeal are important
- Upgraders seeking future‑proof socket compatibility and to maintain thermal headroom
Why Choose This Product
The XPG LEVANTE II 360 stands out by offering a high‑capacity 360 mm radiator, a high‑end dual‑chamber pump with 320 W TDP capability, and an installation‑friendly, visually impressive package. For builders who demand both thermal performance and aesthetics, this cooler offers excellent value and reliable operation backed by a 5‑year warranty. Its universal socket support ensures compatibility with today’s and tomorrow’s CPU platforms.
Frequently Asked Questions
Q: Will the LEVANTE II 360 fit my case?
A: Ensure your chassis has clearance for a 396 × 120 mm radiator size (plus mounting depth) and supports 360 mm AIOs. Many mid‑towers do, but some compact or SFF cases may not.
Q: Can I use this cooler for overclocked or high‑TDP CPUs?
A: Yes — the dual‑chamber pump supports up to ~320 W TDP, making it well‑suited for heavy CPUs and overclocking scenarios.
