Thermal Grizzly Hydronaut 3.9g / 1.5ml Thermal Paste – Excellent Conductivity for Large Coolers and Overclocking
Thermal Grizzly Hydronaut 3.9g / 1.5ml Thermal Paste – Excellent Conductivity for Large Coolers and Overclocking is backordered and will ship as soon as it is back in stock.
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Delivery and Shipping
Shipped within 3 business days
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Thermal Grizzly Hydronaut 3.9g / 1.5ml Thermal Paste – Excellent Co...
| Manufacturer | Thermal grizzly |
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Thermal Grizzly Hydronaut 3.9g (1.5ml) is a high-performance, silicone-free thermal paste designed for large-surface heat sinks and water-cooling systems. It offers excellent thermal conductivity, no curing and outstanding long-term stability, making it ideal for overclocked processors, high-TDP CPUs and GPUs while remaining completely non-electrically conductive.
key features
- Silicone-free formula with excellent thermal conductivity - Delivers efficient heat transfer and high long-term stability without hardening.
- Extremely wide operating temperature range (-200°C to +350°C) - Suitable for cryogenic to high-heat applications and demanding cooling setups.
- Non-electrically conductive + easy application - Safe for sensitive components and simple to spread with the included applicator.
key specifications
| Feature | Specification |
|---|---|
| Product | Thermal Grizzly Hydronaut |
| Content | 3.9 g / 1.5 ml |
| Color | Grey / Light grey |
| Density | 2.6 g/cm³ |
| Viscosity | 140 – 190 Pas |
| Operating Temperature | -200 °C to +350 °C |
| Thermal Resistance | 0.0076 K/W |
| Electrical Conductivity | 0 pS/m (non-conductive) |
| Base | Silicone-free |
| Curing | None |
| Typical Applications | CPUs, GPUs, notebooks, ICs |
| Recommended Use | Large coolers, water cooling, overclocking, high-TDP processors |
* Specifications may vary by region and model variant.
performance excellence
Hydronaut provides very good thermal conductivity optimized for medium- to large-scale heat sinks, particularly water-cooling systems. It maintains stable performance under high thermal loads and overclocking conditions without curing or drying out, ensuring consistent heat transfer over extended periods.
user experience & comfort
The soft consistency and silicone-free carrier make the paste highly flexible and easy to apply. It spreads well under cooler pressure and works excellently with the included applicator, spatula or other methods, delivering clean and precise coverage on large surfaces.
design & build quality
Supplied in a convenient syringe with applicator, Hydronaut is engineered for durability and ease of use. Its low own weight and high flexibility support reliable long-term contact between the heat source and cooler without degradation.
connectivity & compatibility
- Compatible with air and liquid (water) cooling systems
- Suitable for desktop CPUs, GPUs, notebooks and integrated circuits
- Ideal for large-surface heat sinks and high-TDP or overclocked processors (e.g. Intel Core i5/i7, AMD Ryzen 5/7 class)
perfect for
- Water-cooled PC builds and large custom cooling loops
- Overclocked or high-TDP processors and graphics cards
- Users seeking a high-performance, non-curing, silicone-free thermal interface
- Maintenance and upgrades of gaming and workstation systems in Egypt
why choose this product
Thermal Grizzly Hydronaut 3.9g offers an excellent balance of thermal performance, long-term stability and value. Its silicone-free design, wide temperature tolerance and optimization for large coolers make it a trusted choice for enthusiasts and builders who demand reliable cooling without electrical conductivity risks.
frequently asked questions
Q: Is Hydronaut electrically conductive?
A: No. It has zero electrical conductivity (0 pS/m) and is completely safe for use around sensitive electronic components.
Q: Does the paste require curing or harden over time?
A: No. Hydronaut does not cure and offers high long-term stability without hardening.
Q: What systems is it best suited for?
A: It is optimized for large-surface coolers, water-cooling systems, overclocked processors and high-TDP CPUs/GPUs, while also working well on standard air coolers, notebooks and ICs.
